MediaTek’s Dimensity 1050 SoC has just been announced and it’s now the company’s first chip that supports mmWave 5G.
Combined with sub-6GHz, the Dimensity 1050 processor is equipped to handle efficient switching between network bands which results in faster, more stable connection speeds.
The system is built on the ultra-efficient TSMC 6nm production process and supports 3CC carrier aggregation on sub-6 spectrum and 4CC carrier aggregation on mmWave spectrum.
MediaTek says the Dimensitiy 1050 offers a 53-percent increase in speeds and greater reach compared to utilizing just LTE+mmWave aggregation alone.
Additionally, it supports a true dual 5G SIM and can accommodate features such as a Full HD+ display with a 144 refresh rate, dual HDR video capture, advanced noise reduction and improved AI camera actions, and WiFi 63 support.
The company’s gaming optimization tech, HyperEngine 5.0, will also be available alongside support for UFS 3.1 storage and LPDDR5 memory.
Also announced are the new Dimensity 930 and Helio G99 processors.
The Dimensity 930 brings 5G speeds with wider coverage. It also boasts support for MiraVision HDR video playback, 120Hz Full HD+ displays, and HyperEngine 3.0 for gaming.
The Helio G99, on the other hand, adds to the company’s line of gaming-focused processors. Though not 5G, the Helio G99 offers 30 percent more power efficiency compared to the Helio G96.
Devices powered by the Dimensity 930 will first hit the market while Dimensity 1050 and Helio G99-powered devices are expected around the third quarter of 2022.