MediaTek has just announced its newest flagship chipset offering that introduces a number of new technologies to power 5G flagship devices. With a number of firsts under its belt, the new Dimensity 9000 flagship chipset underwent the most advanced and power-efficient chip-making process ever, TSMC N4 production, that has resulted in the world’s first 4nm-class chip.
It will also debut the Cortex-X2’s availability in a smartphone chip. The Armv9 architecture CPUs featured in the Dimensity 9000 are offered as Ultra-Core (1x Arm Cortex-X2) that goes up to 3.05GHz, Super-Core (3x Arm Cortex A710) that goes up to 2.8GHz, and Efficiency Cores (4x ARM Cortex A510). Additionally, the chip supports LPDDR5x 7500Mbps for smartphones.
Working together with the CPU is the latest Arm Matli G710 graphics processor — another first. Alongside the new GPU is a new raytracing SDK that will allow developers to explore new ways to bring their apps to life. This is the Industry’s first raytracing SDK using Vulkan for Android. Refresh rates can go as high as 180Hz for a Full HD+ display.
Upgrades for cameras include another first. With the Dimensity 9000’s 18-bit HDR-ISP design, 4K HDR video recordings are possible using three cameras simultaneously. This is all developed with power efficiency in mind as well.
And upgrading from the previous generation, the Dimensity 9000 offers the world’s first support for 320-megapixel smartphone cameras.
Advancing 5G tech on smartphones, the Dimensity 9000 is the only 5G smartphone modem with 3GPP Release-16 standard tech that offers even faster speeds up to 7Gbps downlink. It’s also the only 5G smartphone modem to support R16 UL Tx Switching for both SUL and NR UL-CA based connections.
The Dimensity 9000 also offers the world’s first Bluetooth 5.3 support for smartphones, Wi-Fi 6E 2×2, and Bluetooth LE Audio-ready technology with Dual-Link True Wireless Stereo Audio. It also supports Beidou III-B1C GNSS support.