In the rapidly evolving world of high-speed communications, South Korean company CIT (Copper Innovation Technology) is making waves – or should we say particles – with its groundbreaking mm Wave Band Antenna technology.
Using innovative atomic sputtering epitaxy (ASE) technology, CIT has developed flexible copper-clad laminate (FCCL) materials that are taking what’s possible in both wired and wireless communications to the next level, and they’re using recycled copper to make this all possible.
Millimeter wave technology is set to play a pivotal role in the future of wireless communication, promising to unlock the full potential of next-generation networks. With its ability to transmit data at lightning-fast speeds and with minimal latency, mmWave is poised to transform everything from smart cities to industrial automation and even healthcare.
CIT’s FCCL material, used in flexible printed circuit boards (FPCBs) boasts impressive capabilities:
- support for 100GHz wireless and 10Gbps wired communications
- world’s lowest transmission loss in FCCL
- ultra-thin copper sheets (from 15 nanometers to 300 manometers!)
- the ability to operate at up to 20GHz frequencies for drones and robots, which is far above the current 7GHz standard
On top of all of this, the copper used by CIT for their mmWave Band Antenna is recycled from used cable.
But what does this all mean? Thanks to the shorter wavelengths of mmWave signals, CIT’s antenna’s smaller compact size opens up exciting possibilities for integration into a wide range of devices and infrastructure.
Plus, the antenna’s ability to transmit data with minimal delay is set to enhance user experience, from video streaming, to responsiveness of IoT devices.
CIT’s antenna’s design also allows it to operate in high-frequency bands of 24-28, 37-40, and 64-71 GHz, providing ample bandwidth to support the explosive growth in data traffic expected in the coming years.
All of this innovation has already attracted major players across several industries, from Harvard Medical School and Massachusetts General Hospital – who are using it for flexible, body-safe sensor patches, to Huawei and Parallel Wireless – who are using it for high-speed communication products in robotics, drones, and automotive technology.
CIT’s focus on mobile devices and their ability to create ultra-thin, high-performance copper materials opens exciting possibilities for the future of connectivity.
This story has been brought to you in partnership with Aving.NET and Pangyo Techno Valley. Pangyo Techno Valley, a global innovation hub in South Korea, hosted the ‘Pangyo Global Media Meet Up’ to share issues from Pangyo and its innovative companies with the world. The event facilitates networking between Pangyo companies and global innovation hubs like Silicon Valley, Station F, and China’s Zhongguancun. It also promotes Korean businesses through global media channels. All thoughts and opinions are 100% our own.